A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Conference paper
Publications
11 results for M. Bergendahl
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Conference paperThermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Conference paperSurface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
Conference paperFully On-Chip MAC at 14 nm Enabled by Accurate Row-Wise Programming of PCM-Based Weights and Parallel Vector-Transport in Duration-Format
- Pritish Narayanan
- Stefano Ambrogio
- et al.
- 2021
- IEEE T-ED
PaperFully on-chip MAC at 14nm enabled by accurate row-wise programming of PCM-based weights and parallel vector-transport in duration-format
- P. Narayanan
- S. Ambrogio
- et al.
- 2021
- VLSI 2021
Conference paperMiddle of Line (MOL) Process Investigation in Ring Oscillator failure
- Victor Chan
- M. Bergendahl
- et al.
- 2020
- ASMC 2020
Conference paperStacked Silicon Microcoolers
- M. Bergendahl
- Dario Goldfarb
- et al.
- 2020
- ITherm 2020
Conference paperYield learning methodologies and failure isolation in ring oscillator circuit for CMOS technology research
- Victor Chan
- Kangguo Cheng
- et al.
- 2019
- IEEE Trans Semicond Manuf
PaperFailure isolation in ring oscillator circuit and defect detection in CMOS technology research
- Victor Chan
- M. Bergendahl
- et al.
- 2019
- ASMC 2019
Conference paper