Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Conference paper
Publications
14 results for Kamal Sikka
Thermal modeling of Direct Bonded Heterogenous Integration (DBHi) MCM package with Si microcooler
- Risa Miyazawa
- Takashi Hisada
- et al.
- 2022
- ITherm 2022
Conference paperA Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Conference paperCharacterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Conference paperSuper Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
Conference paperDimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Conference paperReworkable rehealable packaging materials from the introduction of orthogonal dynamic covalent chemistries
- Teddie Magbitang
- Lucas Moore
- et al.
- 2022
- ITherm 2022
Conference paperSurface Silicon Bridge Direct Bonded Heterogeneous Integration (s-DBHi)
- Kamal Sikka
- Isabel De Sousa
- et al.
- 2022
- EDTM 2022
Conference paperStacked Silicon Microcoolers
- M. Bergendahl
- Dario Goldfarb
- et al.
- 2020
- ITherm 2020
Conference paperOptimal filler sizes for thermal interface materials
- Piyas Chowdhury
- Kamal Sikka
- et al.
- 2019
- ITherm 2019
Conference paper