Transistor scaling with novel materials
- Meikei Ieong
- Vijay Narayanan
- et al.
- 2006
- Materials Today
Paper
Publications
32 results for Anna Topol
Hybrid lithography: The marriage between optical and e-beam lithography. A method to study process integration and device performance for advanced device nodes
- Steven Steen
- Sharee J. McNab
- et al.
- 2006
- Microelectronic Engineering
PaperMobility and CMOS devices/circuits on sub-10nm (110) ultra thin body SOI
- Huiling Shang
- J. Rubino
- et al.
- 2005
- VLSI Technology 2005
Conference paperEnabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
Conference paperAssembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Conference paperHigh performance FDSOI CMOS technology with metal gate and high-k
- Bruce Doris
- Y.-H. Kim
- et al.
- 2005
- VLSI Technology 2005
Conference paperStable SRAM cell design for the 32 nm node and beyond
- Leland Chang
- David M. Fried
- et al.
- 2005
- VLSI Technology 2005
Conference paperLooking into the crystal ball: Future device learning using hybrid E-beam and optical lithography
- S.E. Steen
- S.J. McNab
- et al.
- 2005
- Microlithography 2005
Conference paperEnabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures
- Anna W. Topol
- Bruce K. Furman
- et al.
- 2004
- ECTC 2004
Conference paperAggressively scaled (0.143 μm 2) 6T-SRAM cell for the 32 nm node and beyond
- D. Fried
- J. Hergenrother
- et al.
- 2004
- IEDM 2004
Conference paper