Lithographic Process Optimization for Next-Generation Advanced Packaging Influenced by Wafer Topography and Reticle Stitching
- Chris Bottoms
- Sarah Nahar Chowdhury
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Publications
3 results for Zheng Chen
Evaluation of High NA EUV for Subtractive Interconnect Patterning in Advanced Nodes
- Chris Penny
- Joe Lee
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paperExploring the Limits of Contact Hole Patterning with High NA EUV Lithography
- Dario Goldfarb
- Zheng Chen
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Talk