Publications

81 results for John Knickerbocker

Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- - John U. Knickerbocker
  - Jean Benoit Herou
  - et al.
- 2025
- ECTC 2025
Conference paper
Photonic Modules with High Density Polymer Waveguide Interface
- - J.B. Héroux
  - A. Paz Ramos
  - et al.
- 2025
- OFC 2025
Conference paper
Healthcare Wearable Sensors Adhesion to Human Fingernails and Toenails
- - Katsuyuki Sakuma
  - Leanna Pancoast
  - et al.
- 2023
- Micromachines
Paper
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- - Qianwen Chen
  - Michael Belyansky
  - et al.
- 2023
- ECTC 2023
Conference paper
Voids-free Die-level Cu/ILD Hybrid bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2023
- ECTC 2023
Conference paper
Thermal solution for Co-Packaged Optics (CPO) modules
- - Keiji Matsumoto
  - Mukta Farooq
  - et al.
- 2022
- EDAPS 2022
Conference paper
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2022
- ECTC 2022
Conference paper
Panel Packaging Approach to Micro Thin-film Battery Sealing for Healthcare and Internet of Things (IoT) Applications
- - Qianwen Chen
  - Bing Dang
  - et al.
- 2020
- ECTC 2020
Conference paper
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing
- - Gaddi Blumrosen
  - Katsuyuki Sakuma
  - et al.
- 2020
- IEEE Access
Paper
CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- - Katsuyuki Sakuma
  - Huan Hu
  - et al.
- 2019
- IEEE Sensors Journal
Paper