Advanced wafer bonding and laser debonding
- Paul Andry
- Russell A. Budd
- et al.
- 2014
- ECTC 2014
Conference paper
Publications
81 results for John Knickerbocker
Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
Conference paperNiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
- Bing Dang
- Steven Wright
- et al.
- 2013
- ECTC 2013
Conference paperMeasurement of back end of line thermal resistance for 3D chip stacks
- E.G. Colgan
- R.J. Polastre
- et al.
- 2013
- SEMI-THERM 2013
Conference paperMultiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Conference paper2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Conference paperMicro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
Conference paperAn 8x 10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2012
- IEEE Journal of Solid-State Circuits
PaperTerabit/s-class optical PCB links incorporating 360-Gb/s bidirectional 850 nm parallel optical transceivers
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2012
- Journal of Lightwave Technology
PaperHigh-density silicon carrier transmission line design for chip-to-chip interconnects
- Xiaoxiong Gu
- Lavanya Turlapati
- et al.
- 2011
- EPEPS 2011
Conference paper