Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- John U. Knickerbocker
- Jean Benoit Herou
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
35 results for Sayuri Kohara
Thermomechanical FEM Analysis of Sn-Bi Solder Joint During Temperature Cycling for Fine Pitch 1st Level Interconnect
- Toyohiro Aoki
- Yasuharu Yamada
- et al.
- 2025
- ICEP-IAAC 2025
Conference paperPhotonic Modules with High Density Polymer Waveguide Interface
- J.B. Héroux
- A. Paz Ramos
- et al.
- 2025
- OFC 2025
Conference paperScalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
Conference paperNext Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Conference paperCharacterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Conference paperThermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Conference paperAnalysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- Sayuri Kohara
- Toyohiro Aoki
- et al.
- 2022
- ITherm 2022
Conference paperThermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar
- Takashi Hisada
- Sayuri Kohara
- et al.
- 2022
- ICEP 2022
Conference paperSurface Silicon Bridge Direct Bonded Heterogeneous Integration (s-DBHi)
- Kamal Sikka
- Isabel De Sousa
- et al.
- 2022
- EDTM 2022
Conference paper