Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
Conference paper
Publications
35 results for Sayuri Kohara
Wafer-level non conductive films for exascale servers
- Akihiro Horibe
- Sayuri Kohara
- et al.
- 2014
- ECTC 2014
Conference paperFine-pitch solder joining for high density interconnection
- Kuniaki Sueoka
- Sayuri Kohara
- et al.
- 2014
- ICEP 2014
Conference paperThermo-mechanical evaluation of 3D packages
- Sayuri Kohara
- Akihiro Horibe
- et al.
- 2013
- 3DIC 2013
Conference paperScaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
Conference paperScaling challenges of packaging in the Era of Big Data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- VLSI Technology 2013
Conference paperEffect of preformed IMC layer on electromigration of solder capped cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- IMAPS 2012
Conference paperEffect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- ICSJ 2012
Conference paperEffect of preformed IMC layer on electromigration of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMPACT 2011
Conference paperMicrostructure observation of electromigration behavior in peripheral C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMAPS 2011
Conference paper