Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Conference paper
Publications
35 results for Sayuri Kohara
Development of vacuum underfill technology for a 3D chip stack
- Katsuyuki Sakuma
- Sayuri Kohara
- et al.
- 2011
- JMM
PaperIMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
Conference paperHigh channel count connector for optical interconnect
- Yoichi Taira
- Fumiaki Yamada
- et al.
- 2008
- OF&T 2008
Conference paperPerformance improvement of stacked graphite sheets for cooling applications
- Yoichi Taira
- Sayuri Kohara
- et al.
- 2008
- ECTC 2008
Conference paper