Publications

2 results for Romain Lallement

Lithographic Process Optimization for Next-Generation Advanced Packaging Influenced by Wafer Topography and Reticle Stitching
- - Chris Bottoms
  - Sarah Nahar Chowdhury
  - et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Multi-reticle stitching: Applications from packaging to High-NA EUV
- - Chris Bottoms
  - Rick Johnson
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper