Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- S. Nguyen
- H. Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Conference paper
Publications
147 results for Daniel Edelstein
NanoStack Transistor Architecture for CMOS 7A Node and Beyond
- S. Reboh
- C. Zhang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Conference paperInnovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- D. Edelstein
- A. Jog
- et al.
- 2025
- IITC 2025
Conference paperGraphite Sheet Embedded in an Organic Flip-Chip Package for Heat Spreading
- Keiji Matsumoto
- Daisuke Oshima
- et al.
- 2025
- ECTC 2025
Conference paperThe Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Invited talkBackside power distribution for nanosheet technologies beyond 2nm
- Ruilong Xie
- Wonhyuk Hong
- et al.
- 2024
- VLSI Technology and Circuits 2024
Conference paperReliability and resistance projections for rhodium and iridium interconnects from first-principles
- Nicholas A. Lanzillo
- Daniel C. Edelstein
- 2022
- Journal of Vacuum Science and Technology B
PaperMetal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects
- Koichi Motoyama
- Nicholas A. Lanzillo
- et al.
- 2022
- IITC 2022
Conference paperAdvanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- Takeshi Nogami
- Oleg Gluschenkov
- et al.
- 2022
- VLSI Technology and Circuits 2022
Conference paperScatterometry based methodologies for characterization of MRAM technology
- Manasa Medikonda
- Daniel Schmidt
- et al.
- 2022
- SPIE Advanced Lithography 2022
Conference paper