Post porosity plasma protection integration at 48 nm pitch
- H. Huang
- Krystelle Lionti
- et al.
- 2016
- IITC/AMC 2016
Conference paper
Publications
147 results for Daniel Edelstein
Pre-liner dielectric nitridation for resistance reduction in copper interconnects
- Chih-Chao Yang
- Terry A. Spooner
- et al.
- 2016
- IITC/AMC 2016
Conference paperSequential Lateral Solidification of Silicon Thin Films on Cu BEOL-Integrated Wafers for Monolithic 3-D Integration
- Fabio Carta
- Stephen M. Gates
- et al.
- 2015
- IEEE T-ED
PaperCritical BEOL aspects of the fabrication of a thermally-assisted MRAM device
- E.J. O'sullivan
- Daniel C. Edelstein
- et al.
- 2015
- ECS Meeting 2015 Phoenix
Conference paperEnhanced electromigration resistance through grain size modulation in copper interconnects
- C. C. Yang
- Baozhen Li
- et al.
- 2015
- CSTIC 2015
Conference paperThrough-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
- Takeshi Nogami
- Benjamin D. Briggs
- et al.
- 2015
- IEDM 2015
Conference paperSequential lateral solidification of silicon thin films on low-k dielectrics for low temperature integration
- Fabio Carta
- Stephen M. Gates
- et al.
- 2014
- Applied Physics Letters
PaperCopper-to-dielectric heterogeneous bonding for 3D integration
- Wei Lin
- Juntao Li
- et al.
- 2014
- LTB-3D 2014
Conference paperTDDB at low voltages: An electrochemical perspective
- Ramachandran Muralidhar
- Thomas M. Shaw
- et al.
- 2014
- IRPS 2014
Conference paperPerformance of ultrathin alternative diffusion barrier metals for next - Generation BEOL technologies, and their effects on reliability
- Takeshi Nogami
- M. Chae
- et al.
- 2014
- IITC/AMC 2014
Conference paper