Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- S. Nguyen
- H. Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Conference paper
Publications
27 results for Dominik Metzler
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- D. Edelstein
- A. Jog
- et al.
- 2025
- IITC 2025
Conference paperPredicting and Measuring Scummed Contact Holes
- Elisa Novelli
- Chris A. Mack
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperThe Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Invited talkA novel single damascene process for via metal corrosion-free interconnects in advanced nodes
- Koichi Motoyama
- Dominik Metzler
- et al.
- 2024
- IITC 2024
Conference paperNew approach of local critical dimension uniformity improvement for via/contact hole etch with direct current superposition
- Emilia W. Hirsch
- Dominik Metzler
- et al.
- 2024
- JVSTB
PaperControl of Plasma Etch Conditions through Pulsed, Cyclic, and QALE Processes for Advanced Node Applications
- Dominik Metzler
- 2023
- PESM 2023
Invited talkA novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
Conference paperSubtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Conference paperEtch and Patterning Development for 2nm Node Nanosheet Devices
- Eric Miller
- Indira Seshadri
- et al.
- 2022
- SPIE Advanced Lithography 2022
Invited talk