Publications

25 results for Michael Belyansky

NanoStack Transistor Architecture for CMOS 7A Node and Beyond
- - S. Reboh
  - C. Zhang
  - et al.
- 2025
- VLSI Technology and Circuits 2025
Conference paper
Predictive Simulations and Experimental Study of AlN Bonding for Better Thermal Dissipation in BSPDN
- - Sarabjot Singh
  - Sangshin Jang
  - et al.
- 2025
- IITC 2025
Conference paper
Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- - Sathya Raghavan
  - Ben Yang
  - et al.
- 2025
- ECTC 2025
Conference paper
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- - Qianwen Chen
  - Michael Belyansky
  - et al.
- 2023
- ECTC 2023
Conference paper
Overlay Performance in Permanent Bonded Wafer Integration Schemes
- - Nathan Ip
  - Michael Belyansky
  - et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Conference paper
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2022
- ECTC 2022
Conference paper
A new technique for evaluating stacked nanosheet inner spacer TDDB reliability
- - Tian Shen
  - K. Watanabe
  - et al.
- 2020
- IRPS 2020
Conference paper
A Novel Dry Selective Etch of SiGe for the Enablement of High Performance Logic Stacked Gate-All-Around NanoSheet Devices
- - Nicolas Loubet
  - T. Devarajan
  - et al.
- 2019
- IEDM 2019
Conference paper
Self-Allancd Gate Contact (SAGC) for CMOS technology scaling beyond 7nm
- - Ruilong Xie
  - Chanro Park
  - et al.
- 2019
- VLSI Technology 2019
Conference paper
Study of alternate hardmasks for extreme ultraviolet patterning
- - Anuja De Silva
  - Indira Seshadri
  - et al.
- 2016
- JVSTB
Paper