Chip-package-interaction modeling of ultra low-k/copper back end of line
- X.-H. Liu
- T.M. Shaw
- et al.
- 2007
- IITC 2007
Conference paper
Publications
148 results for Thomas M. Shaw
Delamination in patterned films
- X.-H. Liu
- M.W. Lane
- et al.
- 2007
- Int. J. Solids Struct.
PaperPhysical, electrical, and reliability characterization of Ru for Cu interconnects
- C.-C. Yang
- T. Spooner
- et al.
- 2006
- IITC 2006
Conference paperA 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
Conference paperFormation and Microstructure of Mg‐Si‐O–N Glasses
- T.M. SHAW
- G. THOMAS
- et al.
- 2006
- JACerS
PaperThermal stress evolution in embedded Cu/low-k dielectric composite features
- Conal E. Murray
- Charles C. Goldsmith
- et al.
- 2006
- Applied Physics Letters
Paper65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- V. McGahay
- G. Bonilla
- et al.
- 2006
- IITC 2006
Conference paperTheory for electromigration failure in Cu conductors
- J.R. Lloyd
- C.E. Murray
- et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005
Conference paperRole of oxygen vacancies in VFB/Vt stability of pFET metals on HfO2
- E. Cartier
- F.R. McFeely
- et al.
- 2005
- VLSI Technology 2005
Conference paperEffect of moisture on the Time Dependent Dielectric Breakdown (TDDB) behavior in an ultra-low-k (ULK) dielectric
- J.R. Lloyd
- T.M. Shaw
- et al.
- 2005
- IIRW 2005
Conference paper