DSA via hole shrink for advanced node applications
- Cheng Chi
- Chi Chun Liu
- et al.
- 2016
- SPIE Advanced Lithography 2016
Conference paper
Publications
57 results for Matthew Colburn
High chi block copolymer DSA to improve pattern quality for FinFET device fabrication
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2016
- SPIE Advanced Lithography 2016
Conference paperFin formation using graphoepitaxy DSA for FinFET device fabrication
- Chi Chun Liu
- Fee Li Lie
- et al.
- 2015
- SPIE Advanced Lithography 2015
Conference paperTowards production ready processing with a state-of-the-art EUV cluster
- Karen Petrillo
- Nicole Saulnier
- et al.
- 2015
- SPIE Advanced Lithography 2015
Conference paperSelf-aligned line-space pattern customization with directed self-assembly graphoepitaxy at 24nm pitch
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2015
- SPIE Advanced Lithography 2015
Conference paperEUV processing and characterization for BEOL
- Nicole Saulnier
- Yongan Xu
- et al.
- 2015
- SPIE Advanced Lithography 2015
Conference paperElectrical characterization of FinFETs with fins formed by directed self assembly at 29 nm fin pitch using a self-aligned fin customization scheme
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2014
- IEDM 2014
Conference paperTwo-dimensional pattern formation using graphoepitaxy of PS-b-PMMA block copolymers for advanced FinFET device and circuit fabrication
- Hsinyu Tsai
- Jed W. Pitera
- et al.
- 2014
- ACS Nano
PaperTowards electrical testable soi devices using directed self-assembly for fin formation
- Chi Chun Liu
- Cristina Estrada-Raygoza
- et al.
- 2014
- SPIE Advanced Lithography 2014
Conference paper10nm FINFET technology for low power and high performance applications
- D. Guo
- H. Shang
- et al.
- 2014
- ICSICT 2014
Conference paper