Imaging material components of an integrated circuit interconnect
- Zachary H. Levine
- Steven Grantham
- et al.
- 2003
- Journal of Applied Physics
Paper
Publications
66 results for I.C. Noyan
Probing strain fields about thin film structures using x-ray microdiffraction
- C.E. Murray
- I.C. Noyan
- et al.
- 2003
- MRS Proceedings 2003
Conference paperMapping of strain fields about thin film structures using x-ray microdiffraction
- C.E. Murray
- I.C. Noyan
- et al.
- 2003
- Applied Physics Letters
PaperNanometer precision metrology of submicron Cu/SiO2 interconnects using fluorescence and transmission x-ray microscopy
- Guangyong Xu
- D.E. Eastman
- et al.
- 2003
- Journal of Applied Physics
PaperThe physical design of on-chip interconnections
- Mary Y.L. Wisniewski
- Emmanuel Yashchin
- et al.
- 2003
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
PaperEstimating the efficiency of collaborative problem-solving, with applications to chip design
- M.Y.L. Wisniewski
- E. Yashchin
- et al.
- 2003
- IBM J. Res. Dev
PaperPhase transformation of thin sputter-deposited tungsten films at room temperature
- S.M. Rossnagel
- I.C. Noyan
- et al.
- 2002
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
PaperDifferentiating between elastically bent rectangular beams and plates
- S. Kaldor
- I.C. Noyan
- 2002
- Applied Physics Letters
PaperFinite-size effects in thin-film composites
- Conal E. Murray
- I.C. Noyan
- 2002
- Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties
PaperDetermination of processing damage in thin polycrystalline Ir films using Bragg-peak fringe analysis
- K.L. Saenger
- I.C. Noyan
- 2001
- Journal of Applied Physics
Paper