Void formation and growth during electromigration in thin films
- R. Rosenberg
- M. Ohring
- 2003
- Journal of Applied Physics
Paper
Publications
61 results for Robert Rosenberg
A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
Conference paperElectromigration damage in aluminum film conductors
- M.J. Attardo
- R. Rosenberg
- 2003
- Journal of Applied Physics
PaperReduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
Conference paperVALUE D0Z* for GRAIN BOUNDARY ELECTROMIGRATION in ALUMINUM FILMS
- R. Rosenberg
- 2003
- Applied Physics Letters
PaperResistivity of rf sputter-thinned aluminum films
- A.F. Mayadas
- R.T.C. Tsui
- et al.
- 2003
- Applied Physics Letters
PaperResistance monitoring and effects of nonadhesion during electromigration in aluminum films
- R. Rosenberg
- L. Berenbaum
- 2003
- Applied Physics Letters
PaperGrowth of uniaxial magnetic garnet films by rf sputtering
- J.J. Cuomo
- V. Sadagopan
- et al.
- 2003
- Applied Physics Letters
PaperLiner materials for direct electrodeposition of Cu
- M.W. Lane
- C.E. Murray
- et al.
- 2003
- Applied Physics Letters
PaperInterfacial relationships in microelectronic devices
- Michael Lane
- Robert Rosenberg
- 2003
- MRS Proceedings 2003
Conference paper