Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges
- F. Chen
- Carole Graas
- et al.
- 2015
- Microelectronics Reliability
Paper
Publications
41 results for F. Chen
A method for rapid screening of various low-k TDDB models
- F. Chen
- Carole Graas
- et al.
- 2015
- IRPS 2015
Conference paperImpact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
- Mukta Farooq
- Giuseppe La Rosa
- et al.
- 2015
- IRPS 2015
Conference paperTDDB at low voltages: An electrochemical perspective
- Ramachandran Muralidhar
- Thomas M. Shaw
- et al.
- 2014
- IRPS 2014
Conference paperTemperature and field interrelation study of low-k TDDB for Cu interconnects with and without liner - New insights to the roles of Cu for a competing breakdown process
- Fen Chen
- Michael Shinosky
- et al.
- 2013
- IRPS 2013
Conference paperInvasion percolation model for abnormal time-dependent dielectric breakdown characteristic of low-k dielectrics due to massive metallic diffusion
- Fen Chen
- Michael Shinosky
- et al.
- 2012
- Applied Physics Letters
PaperExperimental confirmation of electron fluence driven, Cu catalyzed interface breakdown model for low-k TDDB
- Fen Chen
- Jeffrey Gambino
- et al.
- 2012
- IRPS 2012
Conference paperCopper through silicon via (TSV) for 3D integration
- C. Kothandaraman
- B. Himmel
- et al.
- 2012
- IRPS 2012
Conference paperIn-situ metal/dielectric capping process for electromigration enhancement in Cu interconnects
- Chih-Chao Yang
- Fen Chen
- et al.
- 2012
- IITC 2012
Conference paperCo capping layers for Cu/low-k interconnects
- C.-C. Yang
- P. Flaitz
- et al.
- 2012
- Microelectronic Engineering
Paper