Warpage analysis of organic substrates for 2.1D packaging
- Sayuri Kohara
- Keishi Okamoto
- et al.
- 2015
- 3DIC 2015
Conference paper
Publications
19 results for Hirokazu Noma
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- Hiroyuki Mori
- Sayuri Kohara
- et al.
- 2015
- InterPACK 2015
Conference paperWarpage modeling technique of organic interposer considering deformation by insulator material shrinkage
- Keishi Okamoto
- Sayuri Kohara
- et al.
- 2015
- ICEP-IAAC 2015
Conference paperHigh-bandwidth density and low-power optical MCM using waveguide-integrated organic substrate
- Masao Tokunari
- Hsiang-Han Hsu
- et al.
- 2014
- Journal of Lightwave Technology
PaperScaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
Conference paperScaling challenges of packaging in the Era of Big Data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- VLSI Technology 2013
Conference paperJoint reliability study of solder capped metal pillar bump interconnections on an organic substrate
- Kazushige Toriyama
- Yasushi Takeoka
- et al.
- 2012
- ICSJ 2012
Conference paperEffect of preformed IMC layer on electromigration of solder capped cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- IMAPS 2012
Conference paperEffect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- ICSJ 2012
Conference paperLow temperature Au-Au flip chip bonding with VUV/O 3 treatment for 3D integration
- Akiko Okada
- Masatsugu Nimura
- et al.
- 2012
- LTB-3D 2012
Conference paper