An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substratesKatsuyuki SakumaKrishna Tungaet al.2015ECTC 2015Conference paper
Flip chip assembly method employing differential heating/cooling for large dies with coreless substratesKatsuyuki SakumaEdmund Blackshearet al.2013ECTC 2013Conference paper
Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnectsBing DangMichael Shapiroet al.2010IEEE Electron Device LettersPaper
Reliable through silicon vias for 3D silicon applicationsM.J. ShapiroM. Interranteet al.2009IITC 2009Conference paper
Three-dimensional silicon integrationJohn U. KnickerbockerPaul S. Andryet al.2008IBM J. Res. DevReview