Publications

2 results for Ravi Bonam

Lithographic Process Optimization for Next-Generation Advanced Packaging Influenced by Wafer Topography and Reticle Stitching
- - Chris Bottoms
  - Sarah Nahar Chowdhury
  - et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2024
- IEDM 2024
Invited talk