Electrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Sari Al Zerey
- Alina Bennett
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
20 results for Roy Yu
Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Conference paperCharacterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Conference paperReworkable rehealable packaging materials from the introduction of orthogonal dynamic covalent chemistries
- Teddie Magbitang
- Lucas Moore
- et al.
- 2022
- ITherm 2022
Conference paper3D stacking of high-performance processors
- Philip Emma
- Alper Buyuktosunoglu
- et al.
- 2014
- HPCA 2014
Conference paperFine pitch transfer and join (T&J) from MCM to 3DI
- R.R. Yu
- 2009
- ISTC/CSTIC 2009
Conference paperReliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
- R.R. Yu
- F. Liu
- et al.
- 2009
- VLSI Technology 2009
Conference paperA 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding
- F. Liu
- R.R. Yu
- et al.
- 2008
- IEDM 2008
Conference paperHigh density 3D integration
- Roy Yu
- 2008
- ICEPT-HDP 2008
Conference paperFinFET performance advantage at 22nm: An AC perspective
- M. Guillorn
- J. Chang
- et al.
- 2008
- VLSI Technology 2008
Conference paper