Bayesian dropout approximation in deep learning neural networks: Analysis of self-Aligned quadruple patterning
- Scott D. Halle
- Derren N. Dunn
- et al.
- 2022
- JM3
Paper
Publications
26 results for Derren Dunn
Speeding up OPC by leveraging existing designs with machine learning
- Cheng Chi
- Julian Dolby
- et al.
- 2021
- SPIE Advanced Lithography 2021
Conference paperBayesian dropout approximation in deep learning neural networks: Analysis of self-aligned quadruple patterning
- Scott D. Halle
- Max O. Bloomfield
- et al.
- 2020
- SPIE Advanced Lithography 2020
Conference paperEUVL mask process development and verification using advanced modeling and characterization techniques
- Michael Green
- Romain Lallement
- et al.
- 2020
- SPIE Advanced Lithography 2020
Conference paperEUV mask challenges and requirements for ultimate single exposure interconnects
- Chris Progler
- Michael Green
- et al.
- 2019
- SPIE Advanced Lithography 2019
Conference paperDesign intent optimization at the beyond 7nm node: The intersection of DTCO and EUVL stochastic mitigation techniques
- Michael Crouse
- L. Liebmann
- et al.
- 2017
- SPIE Advanced Lithography 2017
Conference paperGuiding gate-etch process development using 3D surface reaction modeling for 7nm and beyond
- Derren Dunn
- John R. Sporre
- et al.
- 2017
- SPIE Advanced Lithography 2017
Conference paperA 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
- Ruilong Xie
- Pietro Montanini
- et al.
- 2016
- IEDM 2016
Conference paperEUV patterning successes and frontiers
- Nelson Felix
- Daniel Corliss
- et al.
- 2016
- SPIE Advanced Lithography 2016
Conference paperEtch correction and OPC, a look at the current state and future of etch correction
- Ian Stobert
- Derren Dunn
- 2013
- SPIE Advanced Lithography 2013
Conference paper