M-Series Fan-Out Interposer Technology (MFIT) - Scaling Up for HPC & AI
- Craig Bishop
- Jan Kellar
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
51 results for Arvind Kumar
A Software-Assisted Peak Current Regulation Scheme to Improve Power-Limited Inference Performance in a 5nm AI SoC
- Monodeep Kar
- Joel Silberman
- et al.
- 2024
- ISSCC 2024
Conference paperPower-Limited Inference Performance Optimization Using a Software-Assisted Peak Current Regulation Scheme in a 5-nm AI SoC
- Monodeep Kar
- Joel Silberman
- et al.
- 2024
- IEEE Journal of Solid-State Circuits
PaperSignal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom O. Watanabe
- et al.
- 2023
- ECTC 2023
Conference paperThermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
Conference paperA Heterogeneous and Programmable Compute-In-Memory Accelerator Architecture for Analog-AI Using Dense 2-D Mesh
- Shubham Jain
- Hsinyu Tsai
- et al.
- 2023
- IEEE Transactions on VLSI Systems
PaperA Methodology to Optimize the Number and Placement of Decoupling Capacitors in a Multilevel Power Delivery Network
- Ram Krishna
- Thong Nguyen
- et al.
- 2022
- EDAPS 2022
Conference paperAdvanced modeling and optimization of high performance 32nm HKMG SOI CMOS for RF/analog SoC applications
- Sungjae Lee
- J. Johnson
- et al.
- 2012
- VLSI Technology 2012
Conference paperA Simple, unified 3D stress model for device design in stress-enhanced mobility technologies
- Arvind Kumar
- Kai Xiu
- et al.
- 2012
- SISPAD 2012
Conference paperSub-25nm FinFET with advanced fin formation and short channel effect engineering
- Tenko Yamashita
- Veeraraghvan S. Basker
- et al.
- 2011
- VLSI Technology 2011
Conference paper