A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
Conference paper
Publications
62 results for S. Purushothaman
Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Proceedings - Electronic Components and Technology Conference
PaperLow-voltage, high-mobility pentacene transistors with solution-processed high dielectric constant insulators
- Christos D. Dimitrakopoulos
- Ioannis Kymissis
- et al.
- 1999
- Advanced Materials
PaperOrganic transistors with low operating voltage and high mobility
- C. Dimitrakopoulos
- S. Purushothaman
- et al.
- 1999
- DRC 1999
PaperLow-voltage organic transistors on plastic comprising high-dielectric constant gate insulators
- C. Dimitrakopoulos
- S. Purushothaman
- et al.
- 1999
- Science
PaperDevelopment of conducting adhesive materials for microelectronic applications
- Sung K. Kang
- S. Purushothaman
- 1999
- Journal of Electronic Materials
PaperDUV stability of carbon films for attenuated phase shift mask applications
- Alessandro Callegari
- Katherina Babich
- et al.
- 1998
- SPIE Advanced Lithography 1998
Conference paperDevelopment of low cost, low temperature conductive adhesives
- S.K. Kang
- S. Purushothaman
- 1998
- ECTC 1998
Conference paperDevelopment of high conductivity lead (Pb)-free conducting adhesives
- Sung K. Kang
- Rajinder S. Rai
- et al.
- 1998
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
PaperField-effect transistors comprising molecular beam deposited α,ω-di-hexyl-hexathienylene and polymeric insulator
- Christos D. Dimitrakopoulos
- Bruce K. Furman
- et al.
- 1998
- Synthetic Metals
Paper