Using single-wall carbon nanotubes and raman spectroscopy to measure local stresses in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2011
- IEEE Transactions on CPMT
Paper
Publications
11 results for Soojae Park
Thermal fracture toughness measurement for underfill during temperature change
- Soojae Park
- Claudius Feger
- 2011
- Microelectronics Reliability
PaperDirect measurement of local stress in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2010
- ECTC 2010
Conference paperUnderfill acceleration factor based on thermal fatigue crack growth rate
- Soojae Park
- Claudius Feger
- et al.
- 2010
- ECTC 2010
Conference paperCrack growth rate of thermally induced underfill fatigue
- Soojae Park
- Claudius Feger
- 2009
- ECTC 2009
Conference paperCooling rate dependent underfill fracture toughness
- Soojae Park
- Claudius Feger
- et al.
- 2008
- IMAPS 2008
Conference paperThermal aging of laminate materials and the maximum use temperature of organic packages
- Laura L. Kosbar
- Claudius Feger
- et al.
- 2008
- IMAPS 2008
Conference paperUnderfill fracture toughness as a function of cooling rate
- Soojae Park
- Claudius Feger
- 2008
- ECTC 2008
Conference paperDevelopment of a simple mixed-mode fracture test and the resulting fracture energy envelope for an adhesive bond
- Soojae Park
- David A. Dillard
- 2008
- International Journal of Fracture
PaperCharacterization of the viscoelastic properties of gore® 5510 proton exchange membrane
- Kshitish Patankar
- David Dillard
- et al.
- 2007
- SEM Annual Conference on Experimental and Applied Mechanics 2007
Conference paper