Effect of alloy additions on electromigration failures in thin aluminum films
- A. Gangulee
- F.M. D'Heurle
- 2003
- Applied Physics Letters
Paper
Publications
159 results for F.M. D'Heurle
Coating, mechanical constraints, and pressure effects on electromigration
- N.G. Ainslie
- F.M. D'Heurle
- et al.
- 2003
- Applied Physics Letters
PaperElectromigration in single-crystal aluminum films
- F.M. D'Heurle
- I. Ames
- 2003
- Applied Physics Letters
PaperThermal expansion of the isostructural PtSi and NiSi: Negative expansion coefficient in NiSi and stress effects in thin films
- C. Detavernier
- C. Lavoie
- et al.
- 2003
- Journal of Applied Physics
PaperEffects of alloying elements on cobalt silicide formation
- C. Lavoie
- C. Cabral Jr.
- et al.
- 2002
- Journal of Electronic Materials
PaperIn situ resistivity study of copper-cobalt films: Precipitation, dissolution and phase transformation
- S.-L. Zhang
- J.M.E. Harper
- et al.
- 2001
- Thin Solid Films
PaperOn reactive diffusion: 1 Kinetics, growth and diffusion, 2 equilibrium?
- F.M. D'Heurle
- P. Gas
- et al.
- 2001
- Defect and Diffusion Forum
PaperExploring thin-film reactions by means of simultaneous x-ray surface roughness and resistance measurements
- C. Lavoie
- C. Cabral Jr.
- et al.
- 2001
- Defect and Diffusion Forum
PaperHigh conductivity copper-boron alloys obtained by low temperature annealing
- S.-L. Zhang
- J.M.E. Harper
- et al.
- 2001
- Journal of Electronic Materials
PaperComment on "Dominant diffusing species during cobalt suicide formation" [J. Appl. Phys. 79, 153 (1996)]
- F.M. D'Heurle
- S.-L. Zhang
- 2000
- Journal of Applied Physics
Paper