TEMPERATURE DEPENDENCE OF STRESSES IN Ti, Cr, AND Cu THIN FILMS.
- C.-K. Hu
- D. Gupta
- et al.
- 1984
- VMIC 1984
Conference paper
Publications
118 results for Paul S. Ho
THIN FILM TECHNOLOGY FOR ADVANCED SEMICONDUCTORS. PART 3: VLSI INTERCONNECT METALIZATION.
- P.S. Ho
- 1985
- Semiconductor International
PaperCorrelation of Schottky-barrier height and microstructure in the epitaxial Ni silicide on Si(111)
- M. Liehr
- P.E. Schmid
- et al.
- 1985
- Physical Review Letters
PaperInterdiffusion at the polyimide-Cu interface
- R.M. Tromp
- F. Leqoues
- et al.
- 1985
- JVSTA
PaperPhotoemission spectroscopy study of aluminum-polyimide interface
- J.W. Bartha
- P.O. Hahrt
- et al.
- 1985
- JVSTA
PaperChemical bonding and reaction at metal/polymer interfaces
- P.S. Ho
- P.O. Hahn
- et al.
- 1985
- JVSTA
PaperObservation of local melting in an aluminum bicrystal by molecular dynamics simulation
- Paul S. Ho
- Thomas Kwok
- et al.
- 1985
- Scripta Metallurgica
PaperChemical reactions at Pt/oxide/Si and Ti/oxide/Si interfaces
- M. Liehr
- F.K. LeGoues
- et al.
- 1985
- JVSTA
PaperSummary Abstract: Investigation of the interface chemistry of titanium-tungsten Schottky barrier contacts to silicon by Auger spectroscopy
- J.E. Lewis
- M.O. Aboelfotoh
- et al.
- 1985
- JVSTA
PaperAccurate phase capacitance spectroscopy of transition metal silicon diodes
- Howard L. Evans
- Xu Wu
- et al.
- 1985
- Applied Physics Letters
Paper