Publications

HBM3 Modules on Latest High Density Organic Laminate—Signal Integrity Design and Analysis with Interconnect Budget Results
- - Frank R. Libsch
  - Hiroyuki Mori
- 2023
- ECTC 2023
Conference paper
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- - Qianwen Chen
  - Michael Belyansky
  - et al.
- 2023
- ECTC 2023
Conference paper
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- - Shrivani Pandiya
  - Serge Ecoffey
  - et al.
- 2023
- ECTC 2023
Conference paper
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- - Juliano Borges
  - Maxime Darnon
  - et al.
- 2023
- ECTC 2023
Conference paper
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- - Hussein Hamieh
  - Juliano Borges
  - et al.
- 2023
- ECTC 2023
Conference paper
High Density Photonic Reservoir Computing using Optical Fiber and Polymer Waveguide
- - Hidetoshi Numata
  - Toshiyuki Yamane
  - et al.
- 2023
- ECTC 2023
Conference paper
Fashion Faux Pas: Implicit Stylistic Fingerprints for Bypassing Browsers' Anti-Fingerprinting Defenses
- - Xu Lin
  - Frederico Araujo
  - et al.
- 2023
- S&P 2023
Conference paper
Rethinking Searchable Symmetric Encryption
- - Zichen Gui
  - Kenneth G. Paterson
  - et al.
- 2023
- S&P 2023
Conference paper
Federated Learning with Flexible Control
- - Shiqiang Wang
  - Jake Perazzone
  - et al.
- 2023
- INFOCOM 2023
Conference paper
Adhere: Automated Detection and Repair of Intrusive Ads
- - Yutian Yan
  - Yunhui Zheng
  - et al.
- 2023
- ICSE 2023
Conference paper