Publications

Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- - Aakrati Jain
  - Kamal Sikka
  - et al.
- 2021
- ECTC 2021
Conference paper
Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- - Hiroyuki Mori
  - Sayuri Kohara
- 2021
- ECTC 2021
Conference paper
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- - Katsuyuki Sakuma
  - Mukta Farooq
  - et al.
- 2021
- ECTC 2021
Conference paper
On Focal Loss for Class-Posterior Probability Estimation: A Theoretical Perspective
- - Nontawat Charoenphakdee
  - Jayakorn Vongkulbhisal
  - et al.
- 2021
- CVPR 2021
Conference paper
Separating Skills and Concepts for Novel Visual Question Answering
- - Spencer Whitehead
  - Hui Wu
  - et al.
- 2021
- CVPR 2021
Conference paper
Fashion IQ: A New Dataset towards Retrieving Images by Natural Language Feedback
- - Hui Wu
  - Yupeng Gao
  - et al.
- 2021
- CVPR 2021
Conference paper
Fully on-chip MAC at 14nm enabled by accurate row-wise programming of PCM-based weights and parallel vector-transport in duration-format
- - P. Narayanan
  - S. Ambrogio
  - et al.
- 2021
- VLSI 2021
Conference paper
Energy Efficiency Boost in the AI-Infused POWER10 Processor
- - Brian Thompto
  - Dq Nguyen
  - et al.
- 2021
- ISCA 2021
Conference paper
Cost-effective federated learning design
- - Bing Luo
  - Xiang Li
  - et al.
- 2021
- INFOCOM 2021
Conference paper
A 7nm 4-Core AI Chip with 25.6TFLOPS Hybrid FP8 Training, 102.4TOPS INT4 Inference and Workload-Aware Throttling
- - Ankur Agrawal
  - Saekyu Lee
  - et al.
- 2021
- ISSCC 2021
Conference paper