Publications

Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- - Kamal Sikka
  - Ravi Bonam
  - et al.
- 2021
- ECTC 2021
Conference paper
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- - Katsuyuki Sakuma
  - Dishit Parekh
  - et al.
- 2021
- ECTC 2021
Conference paper
High Density Multi-Chip Module for Photonic Reservoir Computing
- - Jean Benoit Heroux
  - Toshiyuki Yamane
  - et al.
- 2021
- ECTC 2021
Conference paper
CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
- - Risa Miyazawa
  - Chinami Marushima
  - et al.
- 2021
- ECTC 2021
Conference paper
Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- - Aakrati Jain
  - Kamal Sikka
  - et al.
- 2021
- ECTC 2021
Conference paper
Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- - Hiroyuki Mori
  - Sayuri Kohara
- 2021
- ECTC 2021
Conference paper
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- - Katsuyuki Sakuma
  - Mukta Farooq
  - et al.
- 2021
- ECTC 2021
Conference paper
On Focal Loss for Class-Posterior Probability Estimation: A Theoretical Perspective
- - Nontawat Charoenphakdee
  - Jayakorn Vongkulbhisal
  - et al.
- 2021
- CVPR 2021
Conference paper
Separating Skills and Concepts for Novel Visual Question Answering
- - Spencer Whitehead
  - Hui Wu
  - et al.
- 2021
- CVPR 2021
Conference paper
Fashion IQ: A New Dataset towards Retrieving Images by Natural Language Feedback
- - Hui Wu
  - Yupeng Gao
  - et al.
- 2021
- CVPR 2021
Conference paper