Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Conference paper
Publications
23 results at ECTC 2023
Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom O. Watanabe
- et al.
- 2023
- ECTC 2023
Conference paperThermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
Conference paperElectrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- Atom O. Watanabe
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Conference paperHeterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- Katsuyuki Sakuma
- Griselda Bonilla
- et al.
- 2023
- ECTC 2023
Conference paperVolume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- Toyohiro Aoki
- Katsuyuki Sakuma
- et al.
- 2023
- ECTC 2023
Conference paperA Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- Sathya Raghavan
- Aakrati Jain
- et al.
- 2023
- ECTC 2023
Conference paperOn the path to AI hardware via chiplet integration enabled by high density organic substrates
- Griselda Bonilla
- Brian Quinlan
- et al.
- 2023
- ECTC 2023
Conference paperModule, antenna, and package design considerations for mm-scale IoT devices
- Arun Paidimarri
- Duixian Liu
- et al.
- 2023
- ECTC 2023
PosterExtracting Anisotropic Permittivity of PCB Substrate from VNA Measurement on a Rectangular Stripline Resonator Loaded with a Via Array
- Zhaoqing Chen
- Hung Nguyen
- et al.
- 2023
- ECTC 2023
Conference paper