Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- Atom O. Watanabe
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Conference paper
Publications
23 results at ECTC 2023
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023
Conference paperA Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Duixian Liu
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Conference paperHigh Density Photonic Reservoir Computing using Optical Fiber and Polymer Waveguide
- Hidetoshi Numata
- Toshiyuki Yamane
- et al.
- 2023
- ECTC 2023
Conference paperExperimental Identification of the Failure Modes and Failure Mechanisms of Fiber to Waveguide Couplings Under Cyclic Tensile Loading
- Assane Dione
- Jean-Francois Morissette
- et al.
- 2023
- ECTC 2023
Conference paperSolder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
- Hafiz Wakas Ali
- David Danovitch
- et al.
- 2023
- ECTC 2023
Conference paperVoids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Conference paperSignal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom O. Watanabe
- et al.
- 2023
- ECTC 2023
Conference paperThermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
Conference paperHeterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- Katsuyuki Sakuma
- Griselda Bonilla
- et al.
- 2023
- ECTC 2023
Conference paper