Fast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- Prabudhya Roy Chowdhury
- Aakrati Jain
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
26 results for Design and Enablement
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
- Max Bloomfield
- Amogh Wasti
- et al.
- 2025
- ITherm 2025
Conference paperDiagnosing and Prioritizing Issues in Automated Order-Taking Systems: A Machine-Assisted Error Discovery Approach
- Maeda F Hanafi
- Frederick Reiss
- et al.
- 2025
- CHI 2025
Conference paperDose reduction strategies for low-n PSM absorber using pupil and mask bias optimization at 0.33NA EUV lithography
- Rajiv Sejpal
- Gopal Kenath
- et al.
- 2025
- Photomask Japan 2025
Conference paperMulti-reticle stitching: Applications from packaging to High-NA EUV
- Chris Bottoms
- Rick Johnson
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperIBM Telum II: Next Generation 5.5GHz Microprocessor with On-Die Data Processing Unit and Improved AI Accelerator
- Gerald Strevig
- Chris Berry
- et al.
- 2025
- ISSCC 2025
Conference paperTouch Temperature Safety Standards and their Impact on Server Design
- Milnes David
- Felipe Valenzuela
- et al.
- 2024
- ITherm 2024
Conference paperArtifical Intelligence Governed Processor
- Alper Buyuktosunoglu
- David Trilla Rodriguez
- 2024
- ISCA 2024
Workshop paperUnitxt: Flexible, Shareable and Reusable Data Preparation and Evaluation for Generative AI
- Elron Bandel
- Yotam Perlitz
- et al.
- 2024
- NAACL 2024
Demo paperCloud bursting an EDA workload with ML-driven technique for future SoC development
- Wachirawit Ponghiran
- Jinwook Jung
- 2024
- VLSI Technology and Circuits 2024
Workshop paper