Dry Resist Characterization Towards Technology Insertion for 28-36P EUV Patterning
- Yasiel Cabrera
- Gopal Kenath
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Talk
Publications
24 results for Logic Scaling
Viability of HFO-1234ze(E) (trans-1,3,3,3-tetrafluoropropene) as a low global warming potential silicon dioxide etch gas
- Aaron J. Windsor
- Jeremy C. Clark
- et al.
- 2025
- JVSTB
PaperAdvanced Multi-Vt Enabled by Selective Layer Reductions for 2nm Nanosheet Technology and Beyond
- Ruqiang Bao
- Yusuke Oniki
- et al.
- 2024
- IEDM 2024
Conference paperSmall Signal Capacitance in Ferroelectric HZO: Mechanisms and Physical Insights
- Revanth Kodoru
- Atanu Saha
- et al.
- 2024
- arXiv
PaperDTCO Guided Process Integration: Case Studies From FEOL & BEOL with BSPDN
- Minhaz Abedin
- Shahrukh Khan
- et al.
- 2024
- ASMC 2024
Conference paperTopological semimetal interface resistivity scaling for vertical interconnect applications
- Nicholas A. Lanzillo
- Utkarsh Bajpai
- et al.
- 2024
- Applied Physics Letters
PaperNew approach of local critical dimension uniformity improvement for via/contact hole etch with direct current superposition
- Emilia W. Hirsch
- Dominik Metzler
- et al.
- 2024
- JVSTB
PaperEvaluation of (110) versus (001) Channel Orientation for Improved nFET/pFET Device Performance Trade-Off in Gate-All-Around Nanosheet Technology
- Shogo Mochizuki
- Nicolas Loubet
- et al.
- 2023
- IEDM 2023
Conference paperVertical-Transport Nanosheet Technology for Scaling beyond the Lateral-Transport Devices CMOS Era
- Hemanth Jagannathan
- Susan Fan
- et al.
- 2023
- SSDM 2023
Invited talkLogInsights: Understanding and Extracting Information from Logs for Fast Fault Classification by Weak Supervision
- Suranjana Samanta
- Prateeti Mohapatra
- et al.
- 2023
- SSE 2023
Conference paper