Techniques for de-embedding a high port count connector to PCB via interposer
- Yan Ding
- Young H. Kwark
- et al.
- 2011
- ECTC 2011
Conference paper
Publications
Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Conference paperVacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
Conference paperMinor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders
- Sun-Kyoung Seo
- Moon Gi Cho
- et al.
- 2011
- ECTC 2011
Conference paperSolder/adhesive bonding using simple planarization technique for 3D integration
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2011
- ECTC 2011
Conference paperHigh performance wafer level underfill material with high filler loading
- Satoru Katsurayama
- Hiroshi Suzuki
- et al.
- 2011
- ECTC 2011
Conference paperOn-chip high performance slow wave transmission lines using 3D steps for compact millimeter wave applications
- Guoan Wang
- Wayne Woods
- et al.
- 2011
- ECTC 2011
Conference paperTerabit/sec-class board-level optical interconnects through polymer waveguides using 24-channel bidirectional transceiver modules
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2011
- ECTC 2011
Conference paperSurface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
- Fengda Sun
- Yusuf Leblebici
- et al.
- 2011
- ECTC 2011
Conference paperLow-profile 3D silicon-on-silicon multi-chip assembly
- Paul Andry
- Bing Dang
- et al.
- 2011
- ECTC 2011
Conference paper