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- 2007
- Journal of Materials Research
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Publications
14462 results for Physical Sciences
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
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- Journal of Materials Research
PaperInelastic Scattering of Atoms and Molecules from Solid Surfaces
- D.J. Auerbach
- 2007
- Physica Scripta
PaperRydberg Screening in Core Level Photoemission of Ammonia Adsorbed on Nickel Surfaces
- K. Hermann
- P.S. Bagus
- 2007
- Physica Scripta
PaperThe Theory of Ionization Probability in Sputtering
- N.D. Lang
- J.K. Nørskov
- 2007
- Physica Scripta
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- Ming L. Yu
- 2007
- Physica Scripta
PaperOptimization of DUV lithography for high-energy well implantation
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- 2007
- SPIE Advanced Lithography 2007
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- J. Knoch
- M. Zhang
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- 2007
- Applied Physics A: Materials Science and Processing
PaperSupramacromolecular assembly driven by complementary molecular recognition
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- Fred Wudl
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- Macromolecules
PaperThe geometry of quantum chaos
- Martin C. Gutzwiller
- 2007
- Physica Scripta
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