Publications

26917 results for Science

Fundamental Study of Acid Copper Through-Hole Electroplating Process
- - Edward K. Yung
  - Lubomyr T. Romankiw
- 2019
- JES
Paper
Correlation between environmental and electrochemical corrosion of thin film magnetic recording media
- - V. Novotny
  - N. Staud
- 2019
- JES
Paper
Grazing Incidence X-Ray and Electrochemical Study of Thin Film Copper(111) on Mica
- - Gary L. Barges
  - Mahesh G. Samant
- 2019
- JES
Paper
The Mechanism of Electroless Cu Deposition: Extraction of the Oxidative and Reductive Electrochemical Half-Cell Currents from a Complete Bath
- - O.R. Melroy
- 2019
- JES
Paper
Electrodeposition of Nickel-Iron Alloys: 1. Effect of Agitation
- - P.C. Andricacos
  - C. Arana
  - et al.
- 2019
- JES
Paper
Dopant Diffusion in Self-Aligned Silicide/Silicon Structures
- - Marc Wittmer
- 2019
- JES
Paper
Process Damage and Contamination Effects for Shallow Si Implanted GaAs
- - H. Baratte
  - A.J. Fleischman
  - et al.
- 2019
- JES
Paper
The Influence of Attached Bubbles on Potential Drop and Current Distribution at Gas-Evolving Electrodes
- - Charles W. Tobias
- 2019
- JES
Paper
Corrosion of Thin Film Magnetic Disk: Galvanic Effects of the Carbon Overcoat
- - D. Edmonson
  - Michael A. Russak
  - et al.
- 2019
- JES
Paper
Sidewall Spacer Technology for MOS and Bipolar Devices
- - Sang H. Dhong
  - Edward J. Petrillo
- 2019
- JES
Paper