Publications

74 results for Chiplets

Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- - Frank Libsch
  - Steve Bedell
  - et al.
- 2024
- ECTC 2024
Conference paper
Reduced Physics Modeling of Two-Phase Flow through High-Density Cooling Structures
- - Pritish Parida
  - Shurong Tian
  - et al.
- 2024
- ITherm 2024
Conference paper
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- - Sari Zerey
  - Junghyun Cho
  - et al.
- 2024
- ECTC 2024
Conference paper
Effect of Micro-channel Cross-section and Coolant Pressure on Two-Phase Cooling
- - Pritish Parida
- 2024
- ITherm 2024
Conference paper
Systems Two-Phase Cooling
- - Pritish Parida
  - Timothy Chainer
  - et al.
- 2024
- ARPA-E Summit 2024
Poster
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- - Divya Taneja
  - Katherine Pilger
  - et al.
- 2024
- DPC 2024
Conference paper
Design of Analog-AI Hardware Accelerators for Transformer-based Language Models (Invited)
- - Geoffrey Burr
  - Sidney Tsai
  - et al.
- 2023
- IEDM 2023
Invited talk
SyncTREE: Fast Timing Analysis for Integrated Circuit Design through a Physics-informed Tree-based Graph Neural Network
- - Yuting Hu
  - Jiajie Li
  - et al.
- 2023
- NeurIPS 2023
Conference paper
Design of synchronous frequency dividers in 5-nm FinFET CMOS technology
- - Marcel Kossel
  - Pier Andrea Francese
  - et al.
- 2023
- Electronics Letters
Paper
Towards a Formally Verified Security Monitor for VM-based Confidential Computing
- - Wojciech Ozga
  - Guerney Hunt
  - et al.
- 2023
- MICRO 2023
Workshop paper