Position: Agentic Systems Should be General
- Elron Bandel
- Asaf Yehudai
- et al.
- 2026
- ICML 2026
Conference paper
Publications
74 results for Chiplets
High-Resolution Nanoscale X-ray Imaging for Non-Destructive Inspection of Copper Grains in Fine-Pitch Pads for Hybrid Bonding
- Nimish Nazirkar
- Nicholas Polomoff
- et al.
- 2026
- ECTC 2026
Conference paperExploring Cu-Cu Hybrid Bonding Failure Mechanisms under Current Stress via 3D Focused Ion Beam Tomography
- Sari Zerey
- Junghyun Cho
- et al.
- 2026
- ECTC 2026
Conference paperDirect Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paperDirect Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paperFluxless TCB with Atmospheric Pressure Plasma Surface Treatment Enabling Ultra-Fine Pitch Solder Micro-Bumps for 3D Integration
- Mohammed Alhendi
- Luke Darling
- et al.
- 2026
- ECTC 2026
Short paperAdvanced Acoustic Emission (AE) Sensing and Analytics Scheme for In-situ Warpage Characterizations of Flip-Chip Packaging
- Yigit Turan
- Xinchen Wang
- et al.
- 2026
- ECTC 2026
PosterLithographic Process Optimization for Next-Generation Advanced Packaging Influenced by Wafer Topography and Reticle Stitching
- Chris Bottoms
- Sarah Nahar Chowdhury
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paperLithographic Innovations for Advanced Packaging: Enabling Scalable Integration Across Large Fields
- Alex Hubbard
- Christopher Carr
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paperEnabling Enterprise AI with IBM Spyre
- Jeffrey Burns
- Leland Chang
- et al.
- 2025
- IEDM 2025
Invited talk
