Publications

Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- - Akihiro Horibe
  - Chinami Marushima
  - et al.
- 2026
- ECTC 2026
Conference paper
High-Resolution Nanoscale X-ray Imaging for Non-Destructive Inspection of Copper Grains in Fine-Pitch Pads for Hybrid Bonding
- - Nimish Nazirkar
  - Nicholas Polomoff
  - et al.
- 2026
- ECTC 2026
Conference paper
Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- - Akihiro Horibe
  - Chinami Marushima
  - et al.
- 2026
- ECTC 2026
Conference paper
Exploring Cu-Cu Hybrid Bonding Failure Mechanisms under Current Stress via 3D Focused Ion Beam Tomography
- - Sari Zerey
  - Junghyun Cho
  - et al.
- 2026
- ECTC 2026
Conference paper
Breaking the Barrier for Asynchronous MPC with a Friend
- - Banashri Karmakar
  - Aniket Kate
  - et al.
- 2026
- S&P 2026
Conference paper
A Closer Look at Falcon
- - Pierre-alain Fouque
  - Phillip Gajland
  - et al.
- 2026
- Eurocrypt 2026
Conference paper
The Algebraic Isogeny Model: A General Model with Applications to SQIsign and Key Exchanges
- - Marius Aardal
  - Andrea Basso
  - et al.
- 2026
- Eurocrypt 2026
Conference paper
Partial Fraction Techniques for Cryptography
- - Charanjit Jutla
  - Arnab Roy
  - et al.
- 2026
- Eurocrypt 2026
Conference paper
Combining Oblivious Pseudorandom Functions
- - Sebastian Faller
  - Marc Fischlin
  - et al.
- 2026
- Eurocrypt 2026
Conference paper
Detective SAM: Adaptive AI-Image Forgery Localization
- - Gert Lek
  - Nicolas Van Schaik
  - et al.
- 2026
- ICLR 2026
Conference paper