Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- ITherm 2025
Conference paper
Publications
283 results for AI Hardware
Effect of Pressure-dependent TIM Thermal Resistance on Thermal Performance of First-level Packages
- KALIND BARAYA
- Krishna Tunga
- et al.
- 2025
- ITherm 2025
Conference paperNIMA: Near In-Memory High-Precision Accumulation Unit for Heterogeneous Analog/Digital Deep Learning Acceleration
- Irem Sanli
- Elena Ferro
- et al.
- 2025
- ISCAS 2025
Conference paperLive Demonstration: Automated DNN Deployment on the IBM HERMES Project Chip
- Corey Lammie
- Julian Büchel
- et al.
- 2025
- ISCAS 2025
Demo paperAll-in-One Analog AI Hardware: On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices
- Donato Francesco Falcone
- Victoria Clerico
- et al.
- 2025
- Advanced Functional Materials
PaperHardware Implementation of Ring Oscillator Networks Coupled by BEOL Integrated ReRAM for Associative Memory Tasks
- Wooseok Choi
- Thomas Van Bodegraven
- et al.
- 2025
- IMW 2025
Conference paperAnalog AI Accelerators for Transformer-based Language Models: Hardware, Workload, and Power Performance
- H. Tsai
- H. Benmeziane
- et al.
- 2025
- IMW 2025
Conference paperMEADOW: MEMORY-EFFICIENT DATAFLOW AND DATA PACKING FOR LOW POWER EDGE LLMS
- Abhishek Moitra
- Arkapravo Ghosh
- et al.
- 2025
- MLSYS 2025
Conference paperAnalog-AI Hardware Accelerators for low-latency Transformer-based Language Models (Invited)
- Geoffrey Burr
- Sidney Tsai
- et al.
- 2025
- CICC 2025
Invited talkNORA: Noise-Optimized Rescaling of LLMs on Analog Compute-in-Memory Accelerators
- Yayue Hou
- Hsinyu Tsai
- et al.
- 2025
- DATE 2025
Conference paper