Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
Conference paper
Publications
67 results for Chiplets
Evolution of patterning materials towards the Moore's Law 2.0 Era
- Dario L. Goldfarb
- 2022
- Japanese Journal of Applied Physics
PaperInterconnects for DNA, Quantum, In-Memory, and Optical Computing: Insights From a Panel Discussion
- Amlan Ganguly
- Sergi Abadal
- et al.
- 2021
- IEEE Micro
PaperPlasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- Katsuyuki Sakuma
- Dishit Parekh
- et al.
- 2021
- ECTC 2021
Conference paperCopper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- Hiroyuki Mori
- Sayuri Kohara
- 2021
- ECTC 2021
Conference paper3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Conference paperCo-package technology platform for low-power and low-cost data centers
- Konstantinos Papatryfonos
- David R. Selviah
- et al.
- 2021
- Applied Sciences
Paper3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
PaperPackaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2021
- IEEE Journal of Microwaves
ReviewOptical Communication and Energy Conversion for Small-Footprint Edge Computing
- Ning Li
- 2020
- MRS Spring/Fall Meeting 2020
Talk