Copper contact metallization using Ru-based barrier liners for 45 nm and 32 nm nodes: Reliability and device performance
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Conference paper
Publications
24864 results for Exploratory Science
Advanced bilayer low-k dielectric cap for reliable high performance Cu-low k interconnects
- Griselda Bonilla
- Lawrence A. Clevenger
- et al.
- 2008
- ADMETA 2008
Conference paperPorous low-k material etch for 32 nm and beyond
- Catherine Labelle
- John Arnold
- et al.
- 2008
- ADMETA 2008
Conference paperMaterial and process for advanced Cu/ULK integration
- Chih-Chao Yang
- Daniel C. Edelstein
- et al.
- 2008
- ADMETA 2008
Conference paperInsights into the regulation of a common variant of HMGA2 associated with human height during embryonic development
- Yvonne Tay
- Sabrina Peter
- et al.
- 2009
- Stem Cell Reviews and Reports
PaperA qualitative study on project landscapes
- Barthélémy Dagenais
- Harold Ossher
- et al.
- 2009
- ICSE 2009
Conference paperGeographical structure of the Y-chromosomal genetic landscape of the levant: A coastal-inland contrast
- Mirvat El-Sibai
- Daniel E. Platt
- et al.
- 2009
- Annals of Human Genetics
PaperMore is more: The benefits of denser sensor deployment
- Matthew P. Johnson
- Deniz Sariöz
- et al.
- 2009
- INFOCOM 2009
Conference paperLoad balancing for SIP server clusters
- Hongbo Jiang
- Arun Iyengar
- et al.
- 2009
- INFOCOM 2009
Conference paperPrivacy in VoIP networks: A κ-anonymity approach
- Mudhakar Srivatsa
- Arun Iyengar
- et al.
- 2009
- INFOCOM 2009
Conference paper