Properties of ultrathin platinum deposited by atomic layer deposition for nanoscale copper-metallization schemes
- Yu Zhu
- Kathleen A. Dunn
- et al.
- 2007
- Journal of Materials Research
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Publications
3555 results for Materials Discovery
Molecular dynamics simulations of self-assembly and nanotube formation by amphiphilic molecules in aqueous solution: A coarse-grain approach
- Goundla Srinivas
- Michael L. Klein
- 2007
- Nanotechnology
PaperLocating nanowire heterostructures by electron beam induced current
- Anders Gustafsson
- Mikael T. Björk
- et al.
- 2007
- Nanotechnology
PaperImproved electromigration lifetime for copper interconnects using tantalum implant
- Jeff Gambino
- Timothy D. Sullivan
- et al.
- 2007
- MRS Spring Meeting 2007
Conference paperIon beam lithography for nano-scale pattern features
- John E. E. Baglin
- Andrew J. Kellock
- et al.
- 2007
- MRS Proceedings 2007
Conference paperApplication of scatterometry to BEOL measurements: Post Cu CMP measurements
- Deepak Kulkarni
- Shorn Ponoth
- et al.
- 2007
- MRS Spring Meeting 2007
Conference paperSolution-phase deposition and nanopatterning of GeSbSe phase-change materials
- Delia J. Milliron
- Simone Raoux
- et al.
- 2007
- Nature Materials
PaperDelamination in patterned films
- X.-H. Liu
- M.W. Lane
- et al.
- 2007
- Int. J. Solids Struct.
PaperMechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
- Jae-Woong Nah
- Kai Chen
- et al.
- 2007
- Journal of Materials Research
PaperStudy of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
- Sung K. Kang
- M.G. Cho
- et al.
- 2007
- Journal of Materials Research
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