Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
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- 2007
- Journal of Materials Research
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Publications
25371 results for Science
Rewriting queries using views with access patterns under integrity constraints
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- 2007
- Theoretical Computer Science
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- 2007
- IEEE Communications Letters
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- Physica E: Low-Dimensional Systems and Nanostructures
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- 2007
- Physica Scripta
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- 2007
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PaperOptimization of DUV lithography for high-energy well implantation
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- 2007
- SPIE Advanced Lithography 2007
Conference paperPhysics of ultrathin-body silicon-on-insulator Schottky-barrier field-effect transistors
- J. Knoch
- M. Zhang
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- 2007
- Applied Physics A: Materials Science and Processing
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