Transistor scaling with novel materials
- Meikei Ieong
- Vijay Narayanan
- et al.
- 2006
- Materials Today
Paper
Publications
3555 results for Materials Discovery
Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films
Conference paperHydrogen bonding in lubricants for hard disk drives
- Paul H. Kasai
- Vedantham Raman
- 2006
- Tribology Letters
PaperUnderlayer effects on texture evolution in copper films
- C.E. Murray
- K.P. Rodbell
- et al.
- 2006
- Thin Solid Films
PaperThe morphology and nucleation kinetics of copper islands during electrodeposition
- A. Radisic
- P.M. Vereecken
- et al.
- 2006
- Surface Science
PaperResponse of a turbulent boundary layer to sinusoidal free-stream unsteadiness
- W.C. Reynolds
- R. Jayaraman
- 2006
- Journal of Fluid Mechanics
PaperThin film reaction of transition metals with germanium
- S. Gaudet
- C. Detavernier
- et al.
- 2006
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperEffective viscosity of a periodic suspension
- Joseph B. Keller
- 2006
- Journal of Fluid Mechanics
PaperPhoto-oxidation and the absence of photodarkening in Ge2Sb 2Te5 phase change material
- Bong-Sub Lee
- Ying Xiao
- et al.
- 2006
- MRS Spring Meeting 2006
Conference paperAmorphization/templated recrystallization (ATR) method for hybrid orientation substrates
- K.L. Saenger
- J.P. De Souza
- et al.
- 2006
- MRS Spring Meeting 2006
Conference paper