Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
- Mukta Farooq
- Giuseppe La Rosa
- et al.
- 2015
- IRPS 2015
Conference paper
Publications
15 results at IRPS 2015
A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL)
- Ernest Y. Wu
- James Stathis
- et al.
- 2015
- IRPS 2015
Conference paperPhase-change memory: Feasibility of reliable multilevel-cell storage and retention at elevated temperatures
- Milos Stanisavljevic
- A. Athmanathan
- et al.
- 2015
- IRPS 2015
Conference paperSelf-heating characterization of FinFET SOI devices using 2D time resolved emission measurements
- Franco Stellari
- Keith A. Jenkins
- et al.
- 2015
- IRPS 2015
Conference paperA collective relaxation model for resistance drift in phase change memory cells
- Abu Sebastian
- Daniel Krebs
- et al.
- 2015
- IRPS 2015
Conference paperTSV/FET proximity study using dense addressable transistor arrays
- Raphael P. Robertazzi
- Kanak Agarwal
- et al.
- 2015
- IRPS 2015
Conference paperA method for rapid screening of various low-k TDDB models
- F. Chen
- Carole Graas
- et al.
- 2015
- IRPS 2015
Conference paperAnalyzing path delays for accelerated testing of logic chips
- Emily Ray
- Barry P. Linder
- et al.
- 2015
- IRPS 2015
Conference paperLong-term data for BTI degradation in 32nm IBM microprocessor using HKMG technology
- Pong-Fei Lu
- Keith A. Jenkins
- et al.
- 2015
- IRPS 2015
Conference paperSeparation of interface states and electron trapping for hot carrier degradation in ultra-scaled replacement metal gate n-FinFET
- Miaomiao Wang
- Zuoguang Liu
- et al.
- 2015
- IRPS 2015
Conference paper