Measuring Contact Hole Distributions for Use in Predicting Missing Contact Hole RatesElisa NovelliChris A. Macket al.2026SPIE Advanced Lithography + Patterning 2026Conference paper
IBM Lithography Roadmap: Need for Future Lithography Tools and Masks and Requirements for Resists to Avoid Stochastic DefectsAllen GaborMartin Burkhardtet al.2026SPIE Advanced Lithography + Patterning 2026Conference paper
Metal-Oxide Resist Develop Method Down-Select and Process OptimizationNicholas LathamBelle Antonovichet al.2026SPIE Advanced Lithography + Patterning 2026Conference paper
Mitigating X‑ray–Induced Damage in CD‑SAXS Metrology of EUV ResistsPhilipp WieserKevin Yageret al.2026SPIE Advanced Lithography + Patterning 2026Conference paper
Exploring the Limits of Contact Hole Patterning with High NA EUV LithographyDario GoldfarbZheng Chenet al.2026SPIE Advanced Lithography + Patterning 2026Talk
IBM Lithography Roadmap and Need for Future Lithography ToolsAllen GaborMartin Burkhardtet al.2025EUVL and Source Workshop 2025Keynote
Dry heterometallic resist processing based on thermal sublimation deposition and developmentDario GoldfarbScott Lewiset al.2022JM3Paper
23 Sep 2009CNZL200710004363.2Apparatus And Method For Reducing Contamination In Immersion Lithography